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Soder-Wick® Desoldering Braid |
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Soder-Wick®, the world's leading brand of
desoldering braid, is the fastest. cleanest and safest
braid in the industry. It significantly reduces rework/repair
time and minimizes the risk of heat damage to the
board. Its geometrically precise weave design allows
for maximum capillary action and solder capacity.
Soder-Wick® Desoldering Braid optimizes heat
transfer through the braid and into the solder joint,
resulting in faster wicking action than any other
competitive brand. Minimal flux residue on the board
speeds up the cleaning process, or eliminates it
entirely.
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Soder-Wick® BGA
The most effective, economical way to safely and completely
remove solder from BGA pads and chips
Soder-Wick® Rosin
The fastest, safest rosin flux desoldering braid for removing solder
from printed circuit boards Soder-Wick® Rosin
SD
The fastest, safest rosin flux desoldering braid packaged in static
dissipative bobbins
Soder-Wick® No Clean SD
The fastest, cleanest no-clean flux desoldering braid packaged in
static dissipative bobbins
Soder-Wick® Unfluxed
The unfluxed desoldering braid which can be coated with any flux
type
Soder-Wick® Unfluxed SD
The unfluxed desoldering braid packaged in static dissipative bobbins
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